Marble Polishing – Recommended Green Silicon Carbide (GC) Grit Sizes

Process principle: Graded sequential grinding, skip grits not allowed; wet grinding throughout; high-purity GC for light-colored marble to avoid yellowing caused by iron impurities

ProcessGreen SiC GritDescription
Rough Grinding (Leveling, removing deep scratches & pits)60#, 80#, 120#Fast leveling to eliminate height differences and old deep scratches. Use 60# for heavily damaged stone; start with 80# for regular renovation; 120# serves as the final rough grinding step before moving to medium grinding.
Medium Grinding (Transition)180#, 240#, 400#Remove scratches from rough grinding, gradually reduce surface roughness and prepare base for fine grinding.
Fine Grinding800#~1500#Eliminate fine scratches from medium grinding to form uniform matte surface and boost base gloss. Critical pre-step for mirror polishing; common grades: 800# /1000# /1500# in sequence.
Mirror Polishing (High Gloss)2000#~3000#;  micropowder for ultra-mirror finish (≈3000#/5000#)2000#–3000# green SiC grinding blocks/water grinding discs for pre-high-gloss treatment. For premium mirror effect, use ultra-fine green SiC micropowder, can be combined with tin oxide polishing powder for final brightening.

Full Standard Step Sequence (For marble slabs & floor renovation)

80# →120# →180# →240# →400# →800# →1000# →1500# →2000# →3000#  (optional ultra-mirror)

Additional Selection Notes

  1. Soft marble (White Marble, Carrara marble): Lower grinding pressure. Avoid coarse 60#. Start with 80# to prevent stone chipping and deeper scratches.
  2. Green silicon carbide is suitable as raw material for resin water grinding pads / grinding bricks. Diamond pads may be used first for rough leveling, then switch to full GC grinding sequence.
  3. All scratches from the previous grit must be completely removed before advancing to the next grit, otherwise scratches will remain on mirror surface.
  4. Micropowder W designation: W28, W20 for pre-fine grinding; W10, W7, W5 for final mirror polishing (Smaller W number = finer particles)

 

 

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