β‑Silicon Carbide (β‑SiC) Applications in the Semiconductor Industry β‑SiC, also known as 3C‑SiC, features a cubic zinc‑blende crystal structure and is a metastable phase. It differs from the commercially dominant 4H‑SiC (α‑phase hexagonal) for power devices. It has a bandgap of approx. 2.36 eV, high electron mobility, supports hetero‑epitaxy on silicon wafers, and delivers excellent high‑temperature

Green silicon carbide is mainly applied for grinding, rough grinding and lapping processes, rather than final bright polishing. Cerium oxide is mostly adopted for final mirror‑finish polishing. Green silicon carbide removes material allowance by sharp cutting action. It is suitable for glass with relatively high hardness. Low iron impurity content is mandatory to avoid rust

β‑SiC (3C‑SiC cubic silicon carbide) powder possesses far superior sintering activity compared with α‑SiC (hexagonal green/black silicon carbide). It enables densification via lower‑temperature pressure‑less sintering, hot pressing and hot isostatic pressing. Its cubic crystal delivers isotropic thermal‑mechanical properties with fine and uniform grains. After sintering with high‑purity powder, it can be fabricated into structural ceramics

Green Silicon Carbide for Optical‑Glass Processing Green Silicon Carbide (GC, SiC ≥ 98.5‑99%) has a Mohs hardness of 9.3. It features sharp grains, excellent self‑sharpening performance, low impurity content and superior thermal conductivity. As the mainstream abrasive for cold processing of optical glass, it is widely used for multi‑wire sawing, rough grinding, fine grinding, lapping

Green silicon carbide (GC) is the preferred choice for wire cutting of optical glass. Black silicon carbide (BC) is not recommended for this application. The reasons are as follows: Purity Difference Green silicon carbide: High purity (SiC ≥99.0%), low iron content, sharp crystal edges, good self-sharpening property and low impurity content. Black silicon carbide: SiC

What Abrasive Is Used for Wire‑Sawing of Optical Glass?  Green Silicon Carbide (GC) is the preferred abrasive for optical glass wire‑sawing. It delivers high purity, sharp grain edges, good self‑sharpening performance, Mohs hardness 9.2‑9.5, powerful cutting ability and stable chemical properties. Its low‑impurity content and tight particle‑size distribution minimize edge chipping, notches and subsurface cracks