Green Silicon Carbide for Cutting Disc Suspensions
Key Advantages
High hardness & sharpness
Mohs hardness 9.2–9.5, only lower than diamond and CBN. Sharp grains with good self-sharpening, suitable for carbide, glass, ceramics, silicon wafers, quartz and sapphire.
High purity & stability
Purity ≥97%–99%, low impurities, no workpiece contamination. Acid, alkali and high temperature resistant (melting point ≈2250℃).
Excellent thermal conductivity
80–120 W/m·K, effectively removes cutting heat to avoid deformation, chipping and cracking.
Slurry Basic Formulation
- Abrasive: Green silicon carbide micropowder F600–F3000 / W20–W1.5
- Carrier fluid:
- Oil-based: PEG, mineral oil
Water-based: water + dispersant + lubricant
- Additives: dispersant, suspending agent, rust inhibitor, defoamer, bactericide
- Ratio: abrasive 30–50%, liquid 50–70% by weight
Typical Applications
- Free abrasive wire cutting: monocrystalline/polycrystalline silicon, SiC wafers, sapphire, quartz, GaAs, ferrite
- Bonded cutting discs: carbide, stainless steel, ceramics, stone
Selection Guidelines
Grit size
Rough cutting: F280–F600
Precision cutting: F800–F000
Ultra-thin & polishing: F2000–F5000
Purity
Industrial grade: SiC ≥97%
Semiconductor grade: SiC ≥99%, metal impurities <5–10ppm
Particle shape
Spherical/near-spherical: good suspension, high surface quality
Sharp angular: high cutting efficiency
Handling Notes
- Use dispersant to prevent sedimentation (density ≈3.2 g/cm³)
- Keep stirring during cutting for uniform concentration
- Filter and reuse 3–5 times to reduce cost
- Avoid dust inhalation; treat wastewater before discharge
