Green sic 2500# for oil film remover
Green sic uses petroleum coke and the high quality silica as the main raw material, adding salt as additive, via high temperature electric resistance furnace smelting, the smelting into crystals of high purity, high hardness, its hardness is between fused alumina and diamond, and mechanical strength is higher than fused alumina.
Silicon carbide is suitable for processing hard alloy, glass, ceramic and non-metallic materials, are also used in the
semiconductor material, high temperature silicon carbide heating element, far infrared source base material, etc.
Product name: Green sic
Other name: Green silicon carbide; GC ;Green emery;green carborundum ;
CAS number: 409-21-2
Molecular formula: CH8Si
Molecular weight: 48.1597
Character :Green powder
Density(g/mL,25/4℃):3.25
Melting point(ºC):2830
PSD(Particle Size Distribution)
Green sic Particle Size Distribution | ||||
Size | D0 | D3 | D50 | D94 |
2500# | ≤16 | ≤14 | 5.5±0.5 | ≥3.0 |
Applications
Green sic application:oil film remover
stone engraving
diamond grinding wheels- Pipe wear-resistant layer/aircraft engine wear-resistant layer -Auxiliary materials
for the production of diamond tools/ink sheets/dry grinding sheets -High hardness steel tool grinding, single-side and double-side
grinding grinding powder for precision tool grinding and polishing -Functional ceramics/functional ceramic stone/honeycomb
ceramics/architectural ceramics -High hardness silicon wafer cutting/wire cutting/photovoltaic wire cutting -Bearing
processing/bearing ultra-fine processing grinding -Processing ceramic heat sinks/ceramic filters/ceramic membranes/foamed
ceramics/reaction sintered silicon carbide, etc. -Flat double-sided grinding and polishing machine coarse grinding and fine
grinding grinding media -Carbide sandblasting, metal grinding and polishing, tombstone carving -Oilstone/grinding
stone/grindstone/brush roller production -Optical glass/stone polishing/marble polishing wheel/gemstone polishing/polishing disc
polishing -Optoelectronics industry, single crystal silicon/polycrystalline silicon/piezoelectric crystal and other electronic
engineering multi-wire cutting grinding -Teflon coating/polytetrafluoroethylene coating, etc. -Production of nano aerogel new
materials
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